HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias
HDI PCB Board Capabilities include:
Laser Drilled Microvias
Sequential Lamination
Stacked Microvias
Blind & Buried Vias
Via-in-Pad
Laser Direct Imaging
.00275" Trace/Space
Fine Pitch (Down to .3mm)
PCB Manufacture Capacity
| Feature | Capability |
| Service Type | HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 4 - 48ayers |
| Order Quantity | 1pc - 10000+pcs |
| Build Time | 2days - 5weeks |
| Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
| Board Size | Min 6*6mm | Max 457*610mm |
| Board Thickness | 0.4mm - 3.0mm |
| Copper Weight (Finished) | 0.5oz - 2.0oz |
| Min Tracing/Spacing | 2.5mil/2.5mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Surface Finish | HASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP - Organic Solderability Preservatives - RoHS |
| Min Annular Ring | 4mil, 3mil - laser drill |
| Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
| Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
| Other Techniques | Flex-rigid combination
Via In Pad
Buried Capacitor (only for Prototype PCB total area ≤1m²) |
High Quality HDI PCB Manufacturing
HDI PCB designs push the limits of technology and Advanced Circuits is at the forefront of innovation, satisfying the most rigorous requirements.
The demand for HDI PCB manufacturing has been increasing due to the advancements in technology and the many benefits HDI PCBs provide for high-tech applications. Fitting more technology in less space with fewer layers creates limitations for many PCB manufacturers that do not have the specialized equipment and the capacity for advanced features, finer lines, and tighter tolerances. HDI printed circuit board designs utilize a combination of advanced features like microvias, blind vias, via-in-pad, along with stacked and staggered vias to maximize the the space of the board while increasing its performance and functionality.
]High quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.
Shenzhen Yideyi Technology Co., Ltd can provide one-stop service, from the PCB production, the components purchasing to thecomponents assembled.
FAQs:
1, Do you offer quick turn PCB Assembly ?
Yes, we offer 24 hours quick turn PCB Assembled Solution without sacrifice the quality of the PCB Board.
2, Do you offer X-Ray capability ?
Yes, we inspect the boards using X-ray and therefore offer total reliability.
3, Do you offer conformal coating service ?
Yes, conformal coating is a part of our value-added services.
4, Do you offer testing service ?
Yes, we offer robust functional testing that adds to the product reliability.
5, Do you offer IPC 610 or J-STD Quality inspections ?
Absolutely, we offer these inspections as per client requirements.
6, Do you offer first article inspection ?
Yes, basis client requirements, we are well equipped to offer first article inspection.
7, What is your standard turnatound time for PCB Assembly ?
Our standard turnaround time for PCB Assembly is 3 weeks.
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High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias Images
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