Smd Pcb Assembly House
PCB Specification
| Product Name | PCB With SMT Assembly Service |
| Type | Rigid |
| Material | FR4, CEM1, CEM3, High Frequency Board, |
| Layer | 1,2,4,6...20Layer |
| Shape | Rectangular, Round, Slots, Cutouts, Complex, Irregular |
| Cutting | Shear, V-score, Tab-routed |
| Board Thickness | 0.2-4mm, regular 1.6mm |
| Copper Thickness | 0.5-4oz, regular 1oz |
| Solder Mask | Green, Red, Blue, Yellow, etc. |
| Silk Screen | White, Black, etc. |
| Silk Screen Min Line Width | 0.006" or 0.15mm |
| Min Trace/Gap | 0.1mm or 4mils |
| Min Drill Hole Diameter | 0.01",0.25mm or 10mils |
| Surface Finish | HASL, ENIG, OSP, etc. |
Our SMT service:
Fast delivery, 4 million patches/day,
Can be sprayed with three anti-paint,double-sided, FPC
Minimum 01005 and 0.2mmBGA
Maximum 1200mm*400mm
Process of SMT manufacturing
1. Material preparation and examination
Prepare the SMC and PCB and exam if there’s any flaws. The PCB normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads.
2. Stencil preparation
Stencil is used to provide fixed position for solder paste printing. It’s produced according to the designed positions of solder pads on PCB.
3. Solder paste printing
Solder paste, usually a mixture of flux and tin, is used to connect the SMC and solder pads on PCB. It’s applied to PCB with the stencil using a squeegee on a angle range from 45°-60°.
4. SMC placement
The printed PCB then proceed to the pick-and-place machines, where they are carried on a conveyor belt and the electronic components are placed on them.
5. Reflow soldering
Soldering oven: after SMC was placed, the boards are conveyed into the reflow soldering oven.
Pre-heat zone: the first zone in oven is a pre-heat zone, where the temperature of the board and all the components is raised simultaneously and gradually. Temperature ramp up rate in this section is 1.0℃-2.0℃ per second until it reaches 140℃-160℃.
Soak zone: the boards will be kept in this zone on temperature from 140℃-160℃ for 60-90 seconds.
Reflow zone: the boards then enter a zone where the temperature ramp up at 1.0℃-2.0℃ per second to the peak of 210℃-230℃ to melt the tin in the solder paste, bonding the component leads to the pads on the PCB. The surface tension of the molten solder helps keep the components in place.
Cooling zone: a section to ensure solder freezes at exit of heating zone to avoid joint defect.
If the circuit board is double-sided then this printing, placement, reflow process may be repeated using either solder paste or glue to hold the components in place.
6. Clean and inspection
Clean the boards after soldering, and check if there’s any flaws. Rework or repair the defects and store the products. Common equipment related to SMT include magnifying lens, AOI (Automated Optical Inspection), flying probe tester, X-ray machine, etc.
PCB Boards are mainly used in the Iconsumer electronics board,Industrial Control, Medical Treatment, Lighting, Automobile area and ect.
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Small Smd Pcb Assembly House Printed Circuit Board Prototype Manufacturing Images
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